ediflorianUS wrote on 2023-06-05, 12:16:
PcBytes wrote on 2023-06-05, 12:09:
A quick repaste with MX6 should get you going. At least that's what I have to do on my RGH'd Jasper 360, after I swap it in the elite case, and I might be getting a 750 or 1TB drive for it.
I'm afraid to brake the back end of the case , they are fragile , and it's in good state. Will probably blow out with compressor and that's it for now. (I don't have the special opening tool for the back end locking-clips, and anything else leves a mark) at least its 2008-7-11 dated... or someting like that.
LE. Rest of the lot..
As tech repair at work, I see lot of consoles in 5 years, I will tell you:
No, no, you, need, absolutely must take these 360 consoles apart for several things, which you will need to buy the inexpensive special multi-pronged tool and the x-clamp removal tool.
Remove dust build up, which will be massive in these due to EMI shielding boxes has lot of crevices between EMI and plastics for big clumps of dust hiding there.
Repaste heatsinks after completely clean both chips and heatsinks.
Also to check for illegal X-clamp modifications. People were doing absolutely wrong doing this. When this mod was done which removes X-clamps along with original screw down pegs, and used four regular screws, instead the circuit board to clamp the chips to the heatsinks instead of X-clamps. Over time the PCB will relax due to creep due to resin glue is plastic and pressure on the chips is totally lost. Microsoft knew what they were doing with X-clamps design long ago, was very sound design and was used up to Xbox one X. The same design still used on Xbox Series X except for one difference; X-clamp is held in place with four screws. Xbox series S still used X-clamp.
The real reason for dying were their original TIM microsoft specifically used was thermal phase that only melts where heat is on first power cycle during assembly at microsoft's, over time, with thermal cycling that developed air bubbles and thermal particles pumped out out of the space. The TIM reharden as spacer *on the* APU and GPU packages holding heatsinks apart. This is going on still with all of their microsoft consoles including Xbox series S and X. The real fix was replace the TIM with high end thermal paste.
PS3 and PS4 (all) used regular paste instead, less issues but good idea to rebuild them by taking apart for a cleaning and use high end thermal paste.
Great Northern aka Canada.