Arctic Silver used to recommend blending in regular thermal compound, AS3 was current at the time, with their Arctic Silver Epoxy to make it removeable... however, I think that was in context of attaching light aluminum chipset or RAM sinks, not dangling a pound of copper or so.
Then there's the "corner splodge" method, where you use an adhesive as small dots on the corners with a normal application of thermal compound, a long term stable, low mounting pressure required one would be best, in the middle. Then you can rock a razor blade around the corners to free it up, or use dental floss to saw through it.
Unicorn herding operations are proceeding, but all the totes of hens teeth and barrels of rocking horse poop give them plenty of hiding spots.