I have found that when pushing the timings to the limits on these socket 3 boards that the Cyrix 5x86 is even fussier than the AMD X5. I guess I'll try to replace the SRAM modules next. I've pulled 3 dead socket 7 boards to test on. I had wanted to pull their 8 ns SRAMs to use as the TAG on the LS-486E, but unfortunately one of them is 12 ns at 5V; the other is 8 ns, but 3.3 V; and the last is 8 ns, but is of 64Kx8 with 4 extra pins. So looks like I'll be using 10 ns for the TAG as well. I'll experiment with desoldering tomorrow. I also feel that the socket 3 is a bit too close to the SRAM for using the hair dryer hot air gun.
EDIT: I am considering using this technique with one soldering iron, https://www.youtube.com/watch?v=xMXJTLWyBCo , just jump straight to 5:00 as the example there is most fitting for removing the LS-486E's SRAM chips. I didn't see any written details under the video, but looks like he is using solid core copper wire, perhaps in the 20-16 gauge range. The gooey stuff he applies to the IC before heating looks like flux paste, kind of like the flux out of your flux pen, but more viscious. I think I ordered some of this flux paste of similar consistency 2 digikey orders ago. After the IC's are heated with the two parallel copper bard, which T-off his single soldering iron, it looks like he is applying regular leaded solder to the chips to help the leads not making contact with the copper wire to make contact. My main concern is the amount of time the iron is on the leads. As there are cuts in the videos, it may appear shorter than it actually is. I don't think I'd want this kind of heat on there for more than 10 seconds. Unfortunately, the guy doesn't specify how much time was required and if the IC's still work after removal. He also didn't specify his iron's temperature setting. I had the feeling that phantom used this copper wire trick, but used two irons instead of one. I may be able to make a copper wrap for my desolder iron and use two as well, but wouldn't this whole job be easier to just use regular leaded solder, which already has a pretty low melting point and quickly fill both sides of the SRAM with solder, going back and forth, then pull the chip off? I did this with a TSOP before.
I ran some tests with the X5 at 2x66 and 66 MHz to the graphics card only ups the Quake result by 0.1 fps, that is, from 15.7 fps to 15.8 fps.
I tried 50 ns EDO, but it didn't allow any timings faster than my 60 ns EDO when using a 66 MHz FSB.
Plan your life wisely, you'll be dead before you know it.