I would just use Arctic MX-5.

Good thermal adhesive is a thing of the past. Nobody makes any that is worth anything anymore.

cyclone3d wrote on 2022-02-26, 00:33:

I would just use Arctic MX-5.

Good thermal adhesive is a thing of the past. Nobody makes any that is worth anything anymore.

NT H1 is also another good choice it lasts years, NT H2 is just as good but has a problem of pumping out but that shouldn't be an issue under a IHS.

I think when thermal paste has sets it doesn't lose thermal conductivity. Once paste is applied like infinitely thin layer filling all the gaps, it will stay there. It's all about the small particles that works like a filler. Thermal paste thermal conductivity is far less than alu/copper, no matter what they ad. Problem follows if surfaces moves or are detached -> it's no longer uniform and there's no direct die to metal connection. Thermal adhesives I've seen has even lower thermal conductivity than pastes in general (0.9 vs 7.0 W/mK). Just saying I don't see reason to use adhesive on the die if heat spreader is permanently glued on.

Tech ingredients did a video in the past year about thermal paste & epoxy, if memory serves me right.

Well, if you don't need glue/sticky* stuff to keep it in place (jury is still out on that one*) - but can use size+pressure, this might work, though haven't tested it myself yet, and certainly not on(in) a delidded K6... 😅
https://www.amazon.com/Innovation-Cooling-Gra … 8022133-8160039
You can of course cut the pad to a smaller size, while leaving some room in the perimeter for some OTHER sticky stuff to keep the lid or whatever else in place (though depends on how exactly you're going to do all this, and I don't really know how a K6 looks like under the 'hood').

*: Recommandations for thermal tape or glue - mainly for smaller or medium heat sinks

bestemor wrote on 2022-02-28, 00:41:

Well, if you don't need glue/sticky* stuff to keep it in place (jury is still out on that one*) - but can use size+pressure, thi […]
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Well, if you don't need glue/sticky* stuff to keep it in place (jury is still out on that one*) - but can use size+pressure, this might work, though haven't tested it myself yet, and certainly not on(in) a delidded K6... 😅
https://www.amazon.com/Innovation-Cooling-Gra … 8022133-8160039
You can of course cut the pad to a smaller size, while leaving some room in the perimeter for some OTHER sticky stuff to keep the lid or whatever else in place (though depends on how exactly you're going to do all this, and I don't really know how a K6 looks like under the 'hood').

*: Recommandations for thermal tape or glue - mainly for smaller or medium heat sinks

I saw a linus tech tips on that stuff. If I recall it sucked hard core. But is a very interesting idea.

fool wrote on 2022-02-26, 21:12:

I think when thermal paste has sets it doesn't lose thermal conductivity. Once paste is applied like infinitely thin layer filling all the gaps, it will stay there. It's all about the small particles that works like a filler. Thermal paste thermal conductivity is far less than alu/copper, no matter what they ad. Problem follows if surfaces moves or are detached -> it's no longer uniform and there's no direct die to metal connection. Thermal adhesives I've seen has even lower thermal conductivity than pastes in general (0.9 vs 7.0 W/mK). Just saying I don't see reason to use adhesive on the die if heat spreader is permanently glued on.

Back in the day, not sure what they say now, Arctic Silver always used to say the long term stability of their silver compounds wasn't as good as their Ceramique compound which had the best installed lifetime. Recommending the AS for enthusiast systems where you were gonna clean and reinstall yearly or so. Not sure if they "fixed" their silver pastes in the meantime, or whether it's a thing because the silver eventually oxidises.

I see lots of "MG Chemicals - 8329" thermal epoxies for sale.

Has anyone tried that compound?

I've got a 40mhz 486dlc that runs 70c hot and trying to attach a head sink with wire on a PGA132 socket is hard.