pshipkov wrote on 2022-08-29, 18:08:
My point is that soldering pins on the bottom like that will be hacky and messy. […]
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My point is that soldering pins on the bottom like that will be hacky and messy.
1. A separate PCB with SOJ socket on it (or simply solder pads) that can be inserted vertically into the base one with the DIP pins using a SIPP-like connector. This way we can modularize the contraption. Feels like too much. Can be made simpler.
2. Make the PCB longer and move the SOJ chip and the solder pads to the side of the array with DIP legs. This will make the module unsuitable for some motherboards. Especially the ones with 2 columns of sockets.
I’m liking the way that others have done it. Smd pins suck but it is what it is and it looks nice.
If you want a vertical riser style that is also possible but I like the way the two examples are done with smd pins.
Another way is solder resistor leads and spider it out to the pin pads but that will probably look like crap
pshipkov wrote on 2022-08-29, 21:27:
The solder pads are usually not very stable and can peel-off relatively easily, especially if we have leg-pins that insert into slots. The forces at play are much bigger than what individual solder pads are made for.
Did you damage some of the solder pads, or they hold well enough ?
Covering the edges of the pads with solder mask can help a little if there is room.
There is one final way this can be done but it is not universal.
If we map out the locations of all the LIF pins and make one big pcb you could wire the new chip pads to straddle the sockets and just trim the through holes as flush as you can.