First post, by stealthjoe
I have removed the original heatsink from a V3 card and cleaned up the existing thermal paste. The compound on the existing heatsink is in the form of a thin sheet (~1 mm ). Then proceeded to apply MX4 using the pea method after cleaning the core and the heatsink. After applying the compound, attached the heatsink. I did notice a bit of a play on both the diagonal screws despite fully locked in. My query is, could we use a paste based compound like MX4 (which has negligible thickness) as the original thermal pad is a bit thicker. Can it affect the heat transfer performance significantly? Let me know your thoughts? Thanks.
Intel 845GEBV2, Pentium 4 2.4 Ghz, Geforce FX5600 256MB, 512MB RAM, 160GB HDD, Sound Blaster Live! SB0100 - Win 98/XP