Reply 120 of 121, by Sphere478
- Rank
- l33t++
from my recall, the plan I had for 270 was a mirror image of the final design so 180 would be the only one needing a stack.
I was feeling pretty good about the trace layout on the last upload. I was wanting to add ground layers though but it was proposed it would cost too much for that many layers.
I made it in a way that was symetric so that it didn't need to be keyed, my idea for ground was for a spring to be soldered on a central pad that contacted the cpu chip gold cover or an external ground lead.
Mapping out vss and tying /bonding it to the proposed gnd floods and keying(marking)pin one would be possible, though I don't believe the result would be better. it would just ruin the universality of it. though admittingly the universality doesn't have much benefit, wrong insertion is still possible if new pin one location isn't minded.
as for using thru hole for this, maybe someone can figure that out but when I looked at it it looked like asking for a absolute rat's nest. using floods would be the first change in a design like that. the layer count would likely be more than the sxl2 as on the sxl2 many traces didn't have very far to go where as on this they would all have to go far and jump over one another. the thru hole would make space even more limited.
not saying impossible, my 2 cents is try what I made with gnd floods, and see if that works. for 270, just invert the 90 (in software).