Archer57 wrote on Yesterday, 05:32:Did you use glue which can handle up to 100C? It may fall off otherwise...
Also should be really careful with this - pretty easy […]
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Vany wrote on Yesterday, 05:17:
I went with "Solution C" and modified the heatsink by gluing a single 1mm washer on top of it so that the keyboard keeps it squeezed down.
Did you use glue which can handle up to 100C? It may fall off otherwise...
Also should be really careful with this - pretty easy to break the die if you apply uneven pressure. I'd be pretty hesitant to keep it "squeezed" by keyboard just in case i type on it with a bit too much force...
Vany wrote on Yesterday, 05:17:
Now that I've confirmed though that the Radeon chip in the T500 is good, I'll do some stress testing.
Be careful with this. I am not sure it is a good idea to torture old chip with stress tests. If it's working i'd just use it normally and hope it lasts, no reason to basically do accelerated aging/wear on purpose...
I don't believe the Mobile 3650 can reach such temperatures, it is a mid range chip, but if the glue fails, the keyboard will hold it down. Initially I tried with two washers but there was an obvious bump when I started tightening the screws, so I removed one and just kept the one. There is no curve on the keyboard now, don't worry the chip still works 😀
Regarding the stress testing, there won't be any overclock, I plan to only use the laptop as it normally would be used so I'll test video encoding, 3dmark, some actual era-specific games for that chip and such and that is it really. Either way it is a mid-range chip from 2008... if it can at least show me how it behaves after I've done the bare minimum to ensure that it has factory-cooling, stock airflow and clean heatsinks. Goal is to have it under 70C when it plays a heavy game like Crysis. If it doesn't, I'll see what I can do to modify the cooling further.
TLDR: I want to give it the best possible chance at surviving normal workload under "normal" conditions.