arti9m wrote on 2024-12-11, 02:05:
A slight issue here is I am not a PCB or electronics engineer, just a hobbyist. I do understand the basics of signal transmission but I do not know how to properly calculate the impedance for 4-layer board, especially when most but not all of the inner layers are GND & Power planes.
Actually, you would prefer to have a full GND or power plane in the adjacent layer to all impedance controlled traces, preferably uninterrupted in the trace's entire length. The impedance controlled trace "sees" the adjacent plane as a capacitive reference to it self, which is why a 6-layer stackup with dedicated power/ground planes would really ease the layout work, albeit make it more costly.
I'm an electronics engineer, and have been doing PCB layouts for a living for ~15 years, and still don't understand it completely - there's definetely an element of black magic to it as well 🤣
But as a rule of thumb, uninterrupted power and/or ground planes adjacent to every impedance controlled trace, and width of tracks dependent on the actual spacing between layers. Also watch out not to have 2 equally spaced adjacent layers on each side of a trace, as it will then use both as a reference, thus making calculations go totally off 🤣
I think I would go with some stackup something like this if 6-layers is an option.
Signal Layer
prepreg
GND or PWR layer
prepreg
Signal Layer
|||||||| BASE FR4 ||||||||
Signal Layer
prepreg
GND or PWR layer
prepreg
Signal Layer
With prepreg layers of equal thickness, thus having pairs of layers using each plane as a reference.
On the other hand - if you have a working prototype with 4 layers, it's probably not that bad 😎
If it's dual it's kind of cool ... 😎
--- GA586DX --- P2B-DS --- BP6 ---
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