I was able to find public copies of some earlier articles discussing field crystallization failures.
https://www.vishay.com/docs/49268/tn0003-dcleakfailmode.pdf
https://onlinelibrary.wiley.com/doi/abs/10.1155/APEC.3.171
https://onlinelibrary.wiley.com/doi/abs/10.1155/APEC.3.233
Here are several videos that have caught tantalum failures on camera.
https://www.youtube.com/watch?v=Qoy82YBg7Pw
https://www.youtube.com/watch?v=yCQ7ncuT468
https://www.youtube.com/watch?v=A5aoIgz7pXc
https://www.youtube.com/watch?v=X15hLGrxD0s
https://www.youtube.com/watch?v=FItTR0wBywE
Here are a few examples of repairs, where I had a clear diagnosis of why a tantalum failed.
1. Poor design. 486 and earlier AT motherboards tended to have several tantalums serving bypass duty right next to the power supply connector. Almost always directly across voltage rails without any over current protection. Even worse, 16V rated parts were used for the 12V rail.
Many early AT power supplys had poor phase margins. This meant voltage overshoot or ringing would occur at power on, or abrupt load changes. These voltage transients cause small amounts of damage to the dielectric layer in all of the bypass capacitors. This damage is cumulative for dry tantalums, and eventually leads to thermal runaway. Since common 250W AT power supplies could supply 20A on the 5V rail and 9A on the 12V rail, a shorted capacitor will often not trip over current protection.
2. Physical damage to the outer epoxy or plastic encapsulation. Once moisture can get inside, it will damage the dielectric. This leads to an increase in leakage current, which in turn leads to thermal runaway.
3. Incorrect soldering techniques can damage tantalums. Excessive heat will damage the outer encapsulation, again allowing moisture ingress.
While it sounds counter-intuitive, overheated parts and lifted pads are usually caused by an under powered or non temperature controlled soldering iron.
An under powered iron will dump full heating current into the tip to get a solder joint to melt. Once the solder liquefies the power required to maintain the molten solder joint decreases. With an under powered iron, there will be more temperature overshoot compared to a temperature controlled iron with more power.
In conclusion.
Modern manufacturing techniques have minimized impurities inside the capacitor that can lead to field crystallization. Avoid old or salvaged stock.
Modern power supplies are better designed, and are less likely to oscillate or overshoot. Avoid vintage power supplies if possible.
New assembly and preheating techniques minimize exposure to high temperatures. If your budget allows, get a temperature controlled soldering station if you do not have one already. A hot air rework station is also nice to have.
Since none of this is likely to change your opinion, I will now leave you be. My apologies for hijacking your thread.