quicknick wrote on 2022-02-25, 22:05:fsheatsink.jpg
Here's how the heatsink was factory-attached to the cpu in a Fujitsu-Siemens computer. I was going to open a thre […]
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fsheatsink.jpg
Here's how the heatsink was factory-attached to the cpu in a Fujitsu-Siemens computer. I was going to open a thread to ask you guys what type of 'glue' could that be, as I'll be needing to permanently attach a heatsink to some Duron for testing a Socket A board that can't accept a heatsink any more (all three prongs broken on one side of the socket).
But since this discussion is now focused on glue and re-attaching the IHS, I think I'll just ask here, and share my findings with you.
I once got a delidded (but not cleaned) K6-2 from the fleamarket, and the glue remains seemed very similar to what Fujitsu-Siemens used to attach the h/s to the cpu. Also I think AMD used the same 'glue' as a thermal compound, I remember the stuff around the die was about the same hardness as the one in the four corner where the IHS was attached.
Did a little research (in fact too little to be called as such), and I wonder if the glue we're looking at could be "MS Polymer Adhesive". In my next trip to the hardware store I'll buy a tube of such thing and report here.
https://www.permabond.com/resource-center/con … dified-epoxies/
Did a bit of reading on this, I suspect that a two part should be used if used for the die.
I plan of course to use the thermal adhesive on the die though. And the grey rubbery stuff on the corners.
I’m trying to think how I will neatly apply it though. I expect it will be stringy.
Perhaps a dab on the stain on the cramic, then a dab on the corner on the ihs.
We still need someone to make a 3d printed centering tool. Anyone wanna volunteer?
I’m thinking the centering tool should snap onto the cermaic.
And a c clamp can be used to press the die and IHS together for a few days while it all cures with any luck these can be better than factory when done.