VOGONS


First post, by Lylat1an

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My plan is to use Arctic Silver's thermal epoxy to bond a small tower cooler to an AMD K6-II, specifically an Argon THRML 60:

https://argon40.com/products/argon-thrml-50mm … radiator-cooler

It has about the same dimensions as the CPU, thus it won't interfere with the socket's release lever nor nearby components.

What I'm not clear on is whether I should also put a copper "shim" between the cooler and the CPU, and whether I should also install a thermal probe in the process.

De-lidded images of K6-IIs show that the silicon is small and centered, but I think the lid is aluminum.

Would the cooler's dual direct-touch heat pipe design benefit from having a copper heat spreader?

And where might the best place to wedge/tape a front panel thermal probe?

(I know the probe won't be "accurate", but a rough idea is better than nothing.)

Reply 1 of 7, by RetroPCCupboard

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No idea, but that's a cute little cooler. I have never seen a Tower cooler on a socket 7 CPU. Personally I'd only attempt this if the case is horizontal. If it is a tower case, I'd be worried that gravity would cause the CPU to be pulled from the socket.

Reply 2 of 7, by Lylat1an

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RetroPCCupboard wrote on 2026-09-20, 17:16:

No idea, but that's a cute little cooler. I have never seen a Tower cooler on a socket 7 CPU. Personally I'd only attempt this if the case is horizontal. If it is a tower case, I'd be worried that gravity would cause the CPU to be pulled from the socket.

The cooler is definitely cute. 😜

I'm using an IBM 5160 case, which is horizontal.

Reply 3 of 7, by RetroPCCupboard

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K6-II in a 5160 case seems like a unique project. I would be interested to see it when done

Reply 4 of 7, by SSTV2

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My advice would be not to glue it, generally speaking, it's a good idea to avoid permanent or semipermanent mods that involve delicate hardware, a much better cooler securing option would be a custom-made clip. You could modify an existing s370/462 clip or make a custom z-clip from a spring rod. As cooler's base is corrugated, a thin rod would fit there perfectly + it would prevent cooler from moving around.

If cooler's contact area is flat, then a copper shim won't be necessary imho, it would only decrease thermal conductivity, unless you intend to protect a soft aluminium heatspreader from possible scratches?

Reply 5 of 7, by jakethompson1

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Your ZIF socket may not be designed to handle the mass the CPU will have with that cooler attached, and the awkward angle at which it will pull the CPU from the socket.

Reply 6 of 7, by The Solutor

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I suggest to not glue. Sooner or later you'll regret for a reason or another.

Figure a better method, in the worst case plastic ties are good enough, albeit non professional looking.

As for the additional copper pad, it doesen't make sense on a lidded CPU. You add two additional interfaces to the heath path. In the best case nothing changes, in the worst you decrease the thermal performance.

On a delidded CPU, or on natively naked ones, it may make sense.

Reply 7 of 7, by wierd_w

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I'd also avoid glue.

I'd be more of a mind to use a socket retention brace between the heatpipes, and latch it down that way.

You know, one of these.

https://www.ebay.com/itm/278106754555